Read Online Characteristic of Heat Affected Zone in Ultra Thin Au Wire and DynamicTransient Analysis on Underlay Microstructure of Cu/Low-k Wafer - Hsiang-Chen Hsu; Pei-Chieh Chin; Chin-Yuan Hu; Chang-Lin Yehand; Yi-Shao Lai | PDF Online

Download Characteristic of Heat Affected Zone in Ultra Thin Au Wire and DynamicTransient Analysis on Underlay Microstructure of Cu/Low-k Wafer - Hsiang-Chen Hsu; Pei-Chieh Chin; Chin-Yuan Hu; Chang-Lin Yehand; Yi-Shao Lai | ePub

2008-11-08 [[accessioned]]2010-01-21T07:19:05Z [[available]]2010-01-21T07:19:05Z [[issued]]2010-01-21T07:19:05Z Document Type: Archival Material All Authors / Contributors: Hsiang-Chen Hsu; Pei-Chieh Chin; Chin-Yuan Hu; Chang-Lin Yehand; Yi-Shao Lai OCLC Number: 808840353 Language Note: zh_TW [[iso]]en_US Notes: [[extent]]612905 bytes[[mimetype]]application/pdf Abstract: [[abstract]]In this paper, tensile mechanical properties on heat affected zone (HAZ) of ultra thin gold wire before and after electric flame-off (EFO) have been investigated by self-design wire pull test fixture. Characteristics of free air ball (FAB) and HAZ are also carefully investigated by using micro-hardness test and nanoindentation test. The precise experimental material data should be reflected as input for accurate finite element analysis. Numerical model based on explicit time integration scheme software ANSYS/LS-DYNA is developed to predict the first bond on wire bonding process. Dynamic transient analysis is performed to evaluate the overall stress and strain distributions on the microstructure of Cu/Low-k wafer because the crack of supporting layers and delamination of copper vias beneath the bond pad were observed. Special emphasizes are focused on the copper via layout and microstructure optimal design. A series of comprehensive parametric studies were conducted in the present paper.

Title : Characteristic of Heat Affected Zone in Ultra Thin Au Wire and DynamicTransient Analysis on Underlay Microstructure of Cu/Low-k Wafer
Author : Hsiang-Chen Hsu; Pei-Chieh Chin; Chin-Yuan Hu; Chang-Lin Yehand; Yi-Shao Lai
Language : en
Rating :
4.90 out of 5 stars
Type : PDF, ePub, Kindle
Uploaded : Apr 12, 2021

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